Stock List

SOI Wafers in inventory

3" SOI Wafers

Stock ID	Size	Type/Dopant	Orientation	Device			Box	Handle			Qty
	(mm)	D/H		Thick (μm)	Res(ohm.cm)	Finish (P/E)	(μm)	Thick(μm)	Res(ohm.cm)	Finish(P/E)
202	75+/-0.2	P/B	<100>	6+/-1.0	1~10	P	3.0+/-5%	500+/-25	1~10	polished	12
461	75+/-0.2	P/B	<100>	2.5+/-0.5	1~10	P	1.0+/-5%	500+/-25	1~10	polished	4

4" SOI Wafers

Stock ID	Size	Type/Dopant	Orientation	Device			Box	Handle			Qty
	(mm)	D/H		Thick (μm)	Res(ohm.cm)	Finish (P/E)	(μm)	Thick(μm)	Res(ohm.cm)	Finish(P/E)
310	100+/-0.2	P/B	<100>	0.6+/-0.1	10~20	P	1.0+/-5%	675+/-10	1~10	etching	6
311	100+/-0.2	P/B	<100>	1.0+/-0.1	10~20	P	1.0+/-5%	675+/-10	1~10	etching	8
313	100+/-0.2	P/B	<100>	1.5+/-0.1	10~20	P	1.0+/-5%	675+/-10	1~10	etching	8
316	100+/-0.2	P/B	<100>	2.0+/-0.1	10~20	P	1.0+/-5%	675+/-10	1~10	etching	7
317	100+/-0.2	P/B	<100>	2.5+/-0.1	10~20	P	1.0+/-5%	675+/-10	1~10	etching	8
701	100+/-0.2	P/B	<100>	20.0+/-0.1	1~20	P	2.0+/-5%	480+/-10	1~10	polished	1
702	100+/-0.2	P/B	<100>	5.0+/-0.5	1~20	P	0.1+/-5%	380+/-10	1~10	polished	2
703	100+/-0.2	P/B	<100>	10.0+/-1.0	1~20	P	0.1+/-5%	380+/-10	1~10	polished	2
704	100+/-0.2	P/B	<100>	5.0+/-0.5	1~20	P	1.0+/-5%	525+/-10	1~10	polished	4
706	100+/-0.2	P/B	<100>	250+/-5.0	1~20	P	0.5+/-5%	475+/-25	1~10	grinding	3
705	100+/-0.2	P/B	<100>	10+/-1.0	1~20	P	1.0+/-5%	380+/-10	1~10	polished	2
264	100+/-0.2	P/B	<100>	25.0+/-1.0	1~20	P	1.0+/-5%	385+/-10	1~10	polished	1
263	100+/-0.2	P/B	<100>	10.0+/-1.0	1~20	P	0.5+/-5%	500+/-10	1~10	polished	1
262	100+/-0.2	P/B	<100>	50.0+/-1.0	0.01~0.02	P	4.0+/-5%	500+/-10	0.01~0.02	etched	4
257	100+/-0.2	P/B	<100>	120.0+/-1.0	1~10	P	1.0+/-5%	480+/-10	1~10	grinding	2
258	100+/-0.2	P/B	<100>	33.0+/-1.0	1~10	P	1.0+/-5%	480+/-10	1~10	grinding	2
259	100+/-0.2	P/B	<100>	47.0+/-1.0	1~10	P	1.0+/-5%	480+/-10	1~10	grinding	2
256	100+/-0.2	P/B	<100>	5.0+/-1.0	0.008~0.02	P	2.0+/-5%	300+/-10	1~20	polishing	1
248	100+/-0.2	P/B	<100>	10+/-1.0	0.01~0.02	P	2.0+/-5%	450+/-10	1~5	grinding	2
249	100+/-0.2	N/Sb N/P(D)	<100>	200+/-3.0	0.008~0.02	P	1.0+/-5%	200+/-3	0.008~0.02	polishing	16
251	100+/-0.2	N/As(H)	<111>	132+/-3.0	8K~18K	P	0	525+/-25	0.0001~0.005	etching	3
252	100+/-0.2	P/B	<100>	250+/-3.0	1~20	P	2.0+/-5%	300+/-10	1~20	polishing	6
253	100+/-0.2	P/B	<100>	4.0+/-1.0	0.008~0.02	P	1.0+/-5%	500+/-10	1~10	grinding	1
255	100+/-0.2	P/B	<100>	15.0+/-1.0	0.008~0.02	P	2.0+/-5%	300+/-10	1~20	polishing	1
244	100+/-0.2	P/B	<111>	3.5+/-1.0	0.08~0.02	P	2.0+/-5%	500+/-25	1~10	polishing	1
205	100+/-0.2	P/B	<100>	3.0+/-1.0	1~10	P	1.0+/-5%	300+/-10	1~10	polished	1
152	100+/-0.2	N/P	<1-0-0>	2.5+/-0.5	1~10	P	1.0+/-5%	400+/-5	1~10	polished	1
188	100+/-0.2	P/B N/Sb(D)	<100>(H)	5.0+/-1.0	1~10	P	0.5+/-5%	500+/-10	1~10	polished	1
186	100+/-0.2	PB/(H)	<100>	10.0+/-1.0	0.008~0.01	P	2.0+/-5%	455+/-10	1~10	polished	1
180	100+/-0.2	P/B	<100>	25.0+/-2.0	1~10	P	1.0+/-5%	500+/-10	1~10	polished	2
134	100+/-0.2	N/Sb(D) P/B	<1-0-0>	25.0+/-2.0	0.008~0.01	P	0.5+/-5%	350+/-10	1~10	polished	1
189	100+/-0.2	P/B	<100>	25.0+/-1.5	0.015~0.02	P	2.0+/-5%	500+/-10	1~10	polished	3
190	100+/-0.2	P/B	<100>	35.0+/-1.0	1~10	P	1.0+/-5%	500+/-25	1~10	polished	1
150	100+/-0.2	N/Sb	<1-0-0>	40.0+/-2.0	0.008~0.01	P	3.0μ+/-5%	500+/-25	0.008~0.01	etched	1
246	100+/-0.2	P/B	<100>	85.0+/-2.0	0.008~0.01	P	2.0+/-5%	440+/-10	1~10	grinding	11
126	100+/-0.2	P/B	<100>	50.0+/-2.0	1~10	P	1.0+/-5%	440+/-10	1~10	grinding	1
138	100+/-0.2	P/B	<1-0-0>	BPR	3~7	P	1.0μm+/-5%	500+/-25	1~10	P	10
142	100+/-0.2	P/B(D)NP(H)	<1-0-0>	BPR	3~7	P	1.0μm+/-5%	450+/-25	1~10	P	15
144	100+/-0.2	P/B	<1-0-0>	BPR	0.01~0.02	P	0.5μm+/-5%	525+/-25	1~10	P	7
158	100+/-0.2	P/B	<100>	BPR	0.01~0.02	P	0.2+/-5%	525+/-10	1~10	polished	21
161	100+/-0.2	N/Sb(D)N/P(H)	<100>	BPR	0.01~0.02	P	0.2+/-5%	450+/-10	1~5	polished	18
164	100+/-0.2	N/P	<100>	BPR	1~5	P	0.5+/-5%	400+/-10	1~5	polished	25
169	100+/-0.2	P/B	<100>	BPR	1~10	P	0.5+/-5%	450+/-10	1~10	polished	15
191	100+/-0.2	N/Sb	<111>	BPR	<0.06	P	1.0+/-5%	500+/-25	1~10	polished	10
192	100+/-0.2	P/B	<100>	BPR	1~10	P	3.0+/-5%	500+/-25	1~10	polished	14

BPR = Bonded per request

Double SOI Wafer

SID	Size	Type/Dopant	Orientation	Device1		Box	Handle			Device2		Qty
	(mm)	D/H		Thick	Res(ohm.cm)	(μm)	Thick)	Res(ohm.cm)	Finish(P/E)	Thick	Res(ohm.cm)
247	100+/-0.2	P/B	<100>	17.0+/-1.0	1~10	0.3+/-5%	525+/-10	1~10	polished	17.0+/-1.0	1~10	2
250	100+/-0.2	N/P	<100>	15.0+/-1.0	1~10	0.2+/-5%	380+/-10	1~10	polished	15.0+/-1.0	1~10	2

6" SOI Wafers

Stock ID	Size	Type/Dopant	Orientation	Device			Box	Handle			Qty
	(mm)	D/H		Thick (μm)	Res(ohm.cm)	Finish (P/E)	(μm)	Thick(μm)	Res(ohm.cm)	Finish(P/E)
501	150+/-0.2	P/B	<100>	1.0+/-0.1	20~40	P	1.0+/-5%	675+/-25	1~10	polished	10
247	150+/-0.2	P/B	<100>	11.5+/-1.0	0.001~0.004	P	0.5+/-5%	550+/-10	1~10	polished	3
178	150+/-0.2	P/B	<100>	P.R	1~10	P	1.0+/-5%	400+/-10	1~10	P or E	18
201	150+/-0.2	P/B	<100>	P.R	1~10	P	1.0+/-5%	600+/-10	1~10	P or E	17

P or E = Polished or Etching

8" SOI Wafers

Stock ID	Size	Type/Dopant	Orientation	Device			Box	Handle			Qty
	(mm)	D/H		Thick (μm)	Res(ohm.cm)	Finish (P/E)	(μm)	Thick(μm)	Res(ohm.cm)	Finish(P/E)
610	200+/-0.2	P/B	<100>	10.0+/-1.0	0.05~0.2	P	1.0+/-5%	680+/-10	1~10	grinding	4
611	200+/-0.2	P/B	<100>	275+/-5.0	1~20	P	0.5+/-5%	475+/-10	1~10	grinding	50