Wafer Foundry

MEMS Engineering & Materials, Inc. provides the following wafer foundry services to semiconductor and MEMS industries, ranging from single processes to advanced proto-type products.

1. Thin Film Coating

Metal(Au,Cr,Al,Cu,Ni,Pt) thin film, SiO2, SiN by sputtering, evaporation, and CVD.

2. Photolithography Process

Resist coating, contact & step expose, develop. Lift off process.

3. Electroplating and Electroless Plating

Cu, Ni, Au, Solder for interconnect and wafer bumping.

4. Etching

Wet and dry etching.

5. Wafer Bonding

Fusion, anodic, eutectic, polyimide, polymer bonding.

6. Dicing

Silicon, glass.

7. Grinding and Polishing

Silicon wafer grinding and CMP polishing.