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Engineering substrates through wafer bonding

New engineering materials can be created through wafer bonding, with properties superior to single materials. But bonded materials often de-bond in high-temperature anneals because of mismatched coefficients of thermal expansion.

Through decades of research we developed a proprietary low-temperature anneal whose bond strength equals that of a high-temperature anneal. With wafer thinning and exfoliation technology, we have developed the substrates below.

Bonded waferCharacteristicsApplications
Silicon on glass Transparent substrate; High dielectric properties of substrate; Single crystal silicon layer Display, RF devices Inquire
Silicon on sapphire Excellent electrical insulator, reduces radiation-induced current; Resistant to harsh environments RF devices, MEMS sensors Inquire
Silicon on quartz Thermal stability of handle wafer; Transparent substrate RF devices Inquire
III-V compound on silicon III-V compound devices integrated with CMOS devices Silicon photonics Inquire
GaN on silicon Low cost; Less stress in the GaN layer, better properties LEDs Inquire
GaN on diamond/silicon Excellent thermal dissipation of diamond Power devices Inquire
PZT on silicon Thin layer PZT integrated into MEMS MEMS ultrasonic devices, MEMS sensors, energy harvesting devices Inquire
Also available Ultra-uniform SOI wafers · Ultra-flat silicon wafers · Ultra-thin silicon wafers · Silicon-on-glass · Debondable SOI wafers Talk to an engineer →

Wafer foundry service

We provide wafer foundry services to the semiconductor and MEMS industries, ranging from single processes to advanced prototype products.

Request foundry service
  1. 1

    Thin film coating

    Metal (Au, Cr, Al, Cu, Ni, Pt) thin film, SiO₂ and SiN by sputtering, evaporation and CVD.

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  2. 2

    Photolithography

    Resist coating, contact and step exposure, develop. Lift-off process.

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  3. 3

    Electroplating and electroless plating

    Cu, Ni, Au and solder for interconnect and wafer bumping.

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  4. 4

    Etching

    Wet and dry etching.

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  5. 5

    Wafer bonding

    Fusion, anodic, eutectic, polyimide and polymer bonding.

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  6. 6

    Dicing

    Silicon and glass.

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  7. 7

    Grinding and polishing

    Silicon wafer grinding and CMP polishing.

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Emerging technology

Interposers and through-via silicon and glass wafers

Interposers and through-via wafers draw on the same steps as our foundry service: bonding, thinning, plating and polishing. Tell us your via pitch, wafer thickness and metallization and we’ll quote it.

Discuss an interposer project →